Heat Conduction Materials
Boron Nitride(Flake)
Two modified flake boron nitride powder solves the problem of poor compatibility between flake boron nitride and organic systems. The HBN series is suitable for organosilicon systems, and RBN series is suitable for epoxy system.
Application
● Thermal interlace materials: thermal pads, thermal silicone grease, thermally conductive paste, thermally conductive phase change materials.
● Thermal conductivity alumina-based CCL, printed circuit board prepreg.
● Thermally conductive engineering plastics.
Product Detail
Boron Nitride
| Name |
D50(um) |
S.S.A(m2/g) |
Appearance |
BN(%) |
Application System |
| HBN-5 |
6.07 |
4.66 |
Flake |
99 |
Organosilicon |
| HBN-10 |
7.63 |
7.66 |
Flake |
99 |
Organosilicon |
| HBN-15 |
12.6 |
0.9 |
Flake |
99 |
Organosilicon |
| HBN-30 |
24.8 |
0.63 |
Flake |
99 |
Organosilicon |
| RBN-5 |
6.04 |
7.31 |
Flake |
97 |
Organosilicon |
| RBN-10 |
9.34 |
14 |
Flake |
97 |
Organosilicon |
| RBN-30 |
25.89 |
1.66 |
Flake |
97 |
Organosilicon |
